2026-10-11T23:59:30Z https://data.mendeley.com/oai

oai:data.mendeley.com/dv43z9x72t.1 2020-07-10T15:28:28Z

Fleck, Martin Analysis code and raw data for 'Automatic Etch Pit Density Analysis in Multicrystalline Silicon' Mendeley Data "etch_pit_density_analysis.zip" contains the analysis code. See the README.txt for more information. "secco_etched_mc_Si_wafer_image.png" - Optical microscope image, depicting a 2.5cm*1.2cm Secco etched multicrystalline Silicon wafer. Dark spots are etch pits, typically associated with dislocation lines that intersect with the wafer surface. Dark lines are grain boundaries. The leftmost 20% of the wafer have been in contact with the sample carrier during defect etching, explaining the uneven etch result. Surface Etching Dislocation Structure Multicrystalline Silicon Cell Dataset doi:10.17632/dv43z9x72t.1 oai:data.mendeley.com/dv43z9x72t.1 Creative Commons Attribution 4.0 International http://creativecommons.org/licenses/by/4.0 https://data.mendeley.com/datasets/dv43z9x72t 2020-07-10T15:28:28Z 2020-07-10T23:59:59Z