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                <datestamp>2026-09-14T13:28:33Z</datestamp>
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    <dc:creator>Li, Xiangqing</dc:creator>
    <dc:title>Numerical data and reproduction code for Residual-Bounded Transient Thermal Design Framework for Semiconductor Packages: A VCSEL Package Design-Space Study</dc:title>
    <dc:publisher>Mendeley Data</dc:publisher>
    <dc:description>Recalibrated model-generated numerical data and reproduction scripts supporting &quot;Residual-Bounded Transient Thermal Design Framework for Semiconductor Packages: A VCSEL Package Design-Space Study&quot;. Version 2 replaces the pre-recalibration VCSEL snapshot in Version 1; use Version 2 for the current manuscript.

The effective bottom coefficient is calibrated at the nominal design on the same 27-node graph used for the package design-space search, then frozen across designs and selected spatial checks: h_eff = 66574.05281009956 W m^-2 K^-1. The archive records three searches, each with 27,291 center evaluations. Nominal/incumbent peak rises are 4.364751036688206/3.91450898023714 K; the remaining-opportunity computed gap is 0.07828988977246876 K. The prescribed heat pulse is 36.6 W for 1 ms every 10 ms. Version 1&apos;s coefficient, search count and gap must not be used for this manuscript.

Contents include 32 CSV/JSON data files, 15 numerical/checking/figure scripts, 18 figure files, data schemas, SHA256 hashes, reproduction instructions and saved verification records. Unchanged two-node/rod benchmarks are retained; all VCSEL-dependent outputs reflect the same recalibration. The archived files match the current manuscript&apos;s numerical snapshot byte-for-byte.

These are computational outputs, not measured transient device data. Exact-arithmetic bounds apply to the declared finite-graph design family; float64 evaluations do not enclose roundoff, continuum discretization or physical-model uncertainty. The 0.1374 K incumbent model-family sensitivity exceeds the 0.0783 K remaining-opportunity gap. A DC calibration anchor is not independent transient validation.</dc:description>
    <dc:subject>Semiconductor Device</dc:subject>
    <dc:subject>Computational Heat Transfer</dc:subject>
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    <dc:identifier>oai:data.mendeley.com/g5c2zy8zbr.2</dc:identifier>
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    <dc:date>2026-09-14T13:28:33Z</dc:date>
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