2026-10-15T08:16:34Z https://data.mendeley.com/oai

oai:data.mendeley.com/hvtdy6v4mg.1 2026-10-12T16:13:50Z

Li, Haiyang A unified framework for thermoelectric cooling optimization across thermal boundary conditions Mendeley Data Supporting data and original code for the manuscript “A unified framework for thermoelectric cooling optimization across thermal boundary conditions”. The package contains the fixed-device 22-case analytical benchmark, 45,761 current-response samples across 28 allowed intervals, 44 solved matched-current COMSOL models and result files, mesh and energy-balance checks, FEM current-refinement and competing-branch records, figure source data, saved temperature-bound and thermal-conductance sensitivity sweeps, and the retained p-type property table with S30 verification code. Data, documentation and author-owned model configurations use CC BY 4.0; original code uses the MIT licence stated in LICENSE-CODE.txt. COMSOL and external dependencies are excluded. The README, data dictionaries, Figure data map.csv and Source map.csv describe file contents, units, provenance, current figure numbering and scientific scope. Thermoelectric Refrigeration Dataset doi:10.17632/hvtdy6v4mg.1 oai:data.mendeley.com/hvtdy6v4mg.1 Creative Commons Attribution 4.0 International http://creativecommons.org/licenses/by/4.0 https://data.mendeley.com/datasets/hvtdy6v4mg 2026-10-12T16:13:50Z