An obsolescence management framework for a defense industry company
Description
This article proposes how the obsolescence processes of electronic components can be managed as a main process by integrating them into other main processes for large-scale defense industry companies. The focus of this study is the sub-processes of the four main processes related to the management of the defense company's electronic components: project management, research and development, production and services, and supply chain management. A new overarching obsolescence management process integrated into these four main processes have been designed, specifically tailored for a large-scale defense industry company, using a process map example drawn in Microsoft Visio (Appendix A and B). The details of which inputs, outputs, and document packages from the subprocesses of these main processes will be used in the design of the new obsolescence management process are provided in detail in the process maps in the appendices. Original process map of this study including workflows created using Microsoft Visio modeling notation in the appendices are available at Mendeley Data, V1, doi: 10.17632/4xxvrkf2tc.1. Appendices A and B provide process map of the product development and obsolescence management workflow between the four main processes in a defense industry company. In this process map, it can be traced which inputs and outputs of the four main processes and subprocesses related to obsolescence management, containing data for electronic components, will be utilized. The process map is presented as workflows created using Microsoft Visio modeling notation in the appendices is also available at Mendeley Data, V1, doi: 10.17632/4xxvrkf2tc.1. The analysis of the current workflow between the four main processes can be found in the first 4 columns of Appendix A. The rightmost column depicts the newly established obsolescence management process and subprocesses designed as a main process for the company, aligned with these four main processes, along with the inputs and outputs of these subprocesses. An example of the application of the shell structure model is depicted as a process map design in the appendices, illustrating the processes of a defense industry company. On the x-coordinate of the figure in Appendices A and B, these four main processes and subprocesses are represented. The x-coordinate analyses these four main processes on the vertical separation. The three design phases are presented on the y-coordinate: concept design, preliminary design, and critical design. The three design phases are used to understand how electronic components progress within the company's existing workflows and transform into Bill of Materials (BOM) lists to be transferred to the production process. These three design phases are selected as milestones in designing the process map in the appendices. The points at which electronic components are included in the product lifecycle can be traced from these phases.