Electrode temperature and current dataset for thermal compression bonding processes

Description

V1: This data is the temperature and current data of the optimal welding parameters of the thermal compression bonding electrode: the initial electrode temperature of 80 ℃, the temperature rise time of 500 ms, the holding time of 4000 ms, which can be used for the crack simulation of the thermal compression bonding electrode to obtain simulation data, V2: A batch of thermal compression bonding electrodes of the same specification was customized and initial defects of different lengths oriented towards the upper right 58° direction and in the range of 0.0-3.0 mm at intervals of 0.1 mm were preset at the location of crack initiation using the wire-cutting method with a wire diameter of 0.2 mm, and a total of 31 weld heads were produced. The initial temperature of the test electrodes ranged from 80-130 °C. The initial temperature of the test electrodes was set at 5 °C intervals. At 5 °C intervals, 11 data were measured under each defect length weld head, and a total of 341 data were measured for the 31 customized weld heads. This data can be used to predict the prediction of the electrode current profile for thermal compression bonding.

Steps to reproduce

Software: Abaqus 2020 Electrode: The sheet-shaped pulsed TCB electrode (HT-16-15) Sensor: The Hall current sensor Application: Soldering of 0.3 mm2 multi-stranded copper cables with 1.8 mm pitch and 4 pins to printed circuit boards (PCBs) with tinned pads. Thermal imaging camera: FOTRIC 226s

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