Defect inspection of solder bumps using the scanning acoustic microscopy and fuzzy SVM algorithm

Published: 07-10-2016| Version 1 | DOI: 10.17632/9n5z75smz3.1
Contributor:
Mengying Fan

Description

Data accompanied with the paper 'Defect inspection of solder bumps using the scanning acoustic microscopy and fuzzy SVM algorithm'. Figure 1 is the original C-scan SAM image of the FA10 flip chip sample. Table 1 shows the numerical values of the features.

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