Supporting information for 'Equipment-friendly encapsulation structure of SiO2/Cu for efficient infrared shield'

Name: Supporting information for 'Equipment-friendly encapsulation structure of SiO2/Cu for efficient infrared shield'
Creator: xiaonan li
Published: 2022-01-10T17:12:09.915Z
Keywords: Aerospace Material

li, xiaonan

doi:10.17632/g5ff7p9vmm.2

Supporting information for 'Equipment-friendly encapsulation structure of SiO2/Cu for efficient infrared shield'

Published: 10 January 2022| Version 2 | DOI: 10.17632/g5ff7p9vmm.2

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xiaonan li

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Supporting information for 'Equipment-friendly encapsulation structure of SiO2/Cu for efficient infrared shield'

Supporting information for 'Equipment-friendly encapsulation structure of SiO2/Cu for efficient infrared shield'

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