Evaluation of IRT-NDT for solder in solenoid coil connector

Published: 26 August 2021| Version 1 | DOI: 10.17632/g8934tp6pd.1
Benjamin Giron-Palomares,
Zhao Dong,
Francisco Oviedo-Tolentino


This is a compilation of the results on the measurements of temperatures by using thermocouples and an infrared camera to test the capacity of Infrared Thermography Nondestructive Methodology to detect solder joint defects in a connector of a particular solenoid coil. Two example videos of the thermal process captured by the infrared camera during the experiments are provided. Discrimination analyses results, as well as repeatibility analyses results, are given too. The ANOVA based discrimination analyses make paired comparisons among the good solder and defective solders, providing a probability of being the same (P) with a 95% confidence interval, as well as the minimum, mean, and maximum differences in excess temperatures encountered. Minimum differences in excess temperature larger than 2 degrees Celsius give a conservative criterion to determine if a defective solder joint can be distinguished from a good solder joint.



Universidad Autonoma de San Luis Potosi, Anyang Institute of Technology


Thermal Analysis, Non-Destructive Testing, Analysis of Variance, Experimental Research, Thermal Infrared Remote Sensing