Dynamic Mechanical Analysis (DMA) data for thermoset based structural adhesive Henkel Teroson EP5089

Published: 10 December 2021| Version 1 | DOI: 10.17632/k6pggf8zxw.1
Contributor:
AKSHAT AGHA

Description

The attached data is the result of a temperature-frequency sweep performed on Henkel Teroson EP5089. The DMA data can be used to study the viscoelastic behavior of the epoxy-based thermoset adhesive.

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Steps to reproduce

The tests were performed on a TA Instruments DMA for a temperature-frequency sweep. The frequency was varied from 0.1Hz to 100Hz for a temperature range of -50C to 200C. The storage modulus, loss modulus, and loss factor are provided.

Institutions

Clemson University Department for Automotive Engineering, Clemson University International Center for Automotive Research

Categories

Rheology, Mechanical Property, Adhesive Bonding, Adhesive, Bonded Joint, Epoxy, Dynamic Analysis

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