Dynamic Mechanical Analysis (DMA) data for thermoset based structural adhesive Henkel Teroson EP5089

Published: 10 December 2021| Version 1 | DOI: 10.17632/k6pggf8zxw.1
Contributor:
AKSHAT AGHA

Description

The attached data is the result of a temperature-frequency sweep performed on Henkel Teroson EP5089. The DMA data can be used to study the viscoelastic behavior of the epoxy-based thermoset adhesive.

Files

Steps to reproduce

The tests were performed on a TA Instruments DMA for a temperature-frequency sweep. The frequency was varied from 0.1Hz to 100Hz for a temperature range of -50C to 200C. The storage modulus, loss modulus, and loss factor are provided.

Institutions

  • Clemson University Department for Automotive Engineering
  • Clemson University International Center for Automotive Research

Categories

Rheology, Mechanical Property, Adhesive Bonding, Adhesive, Bonded Joint, Epoxy, Dynamic Analysis

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