Dynamic Mechanical Analysis (DMA) data for thermoset based structural adhesive Henkel Teroson EP5089
Published: 10 December 2021| Version 1 | DOI: 10.17632/k6pggf8zxw.1
Contributor:
AKSHAT AGHADescription
The attached data is the result of a temperature-frequency sweep performed on Henkel Teroson EP5089. The DMA data can be used to study the viscoelastic behavior of the epoxy-based thermoset adhesive.
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Steps to reproduce
The tests were performed on a TA Instruments DMA for a temperature-frequency sweep. The frequency was varied from 0.1Hz to 100Hz for a temperature range of -50C to 200C. The storage modulus, loss modulus, and loss factor are provided.
Institutions
Clemson University Department for Automotive Engineering, Clemson University International Center for Automotive Research
Categories
Rheology, Mechanical Property, Adhesive Bonding, Adhesive, Bonded Joint, Epoxy, Dynamic Analysis