Dataset for "In-situ characterization of solidification and microstructural evolution during interrupted thermal fatigue in SAC305 and SAC105 solder joints using high energy X-ray diffraction and post-mortem EBSD analysis"

Published: 24 December 2020| Version 1 | DOI: 10.17632/k7cz57hz99.1
Quan Zhou,
Tae-kyu Lee,
Thomas Bieler


This data set contains: 1) Images of diffraction patterns collected during in-situ cooling of the CABGA corner joints 2) Log files contain indexed orientations of the solder joints at different thermal cycling stages from Fable, using different "Peak Search" thresholds. 3) Raw EBSD scan data of samples at TC-750