Differential Scanning Calorimetry (DSC) data for Curing Kinetics Study of thermoset based structural adhesive Henkel Teroson EP5089
Published: 10 December 2021| Version 1 | DOI: 10.17632/tt87pfzkkg.1
The attached data is the differential scanning calorimetry data for Henkel Teroson EP5089.
Steps to reproduce
The tests were performed on a TA Instruments DSC for isothermal heating ramps of 0.5K/min, 1K/min, 2K/min, and 5K/min. The enthalpies from the tests are provided. The enthalpies were integrated to obtain the degree of cure with time and temperature.
Clemson University Department for Automotive Engineering, Clemson University International Center for Automotive Research
Differential Scanning Calorimetry, Adhesive Bonding, Adhesive, Adhesive Property, Mechanical Joint, Bonded Joint, Mechanical Design