Differential Scanning Calorimetry (DSC) data for Curing Kinetics Study of thermoset based structural adhesive Henkel Teroson EP5089

Published: 10 December 2021| Version 1 | DOI: 10.17632/tt87pfzkkg.1
Contributor:
AKSHAT AGHA

Description

The attached data is the differential scanning calorimetry data for Henkel Teroson EP5089.

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Steps to reproduce

The tests were performed on a TA Instruments DSC for isothermal heating ramps of 0.5K/min, 1K/min, 2K/min, and 5K/min. The enthalpies from the tests are provided. The enthalpies were integrated to obtain the degree of cure with time and temperature.

Institutions

  • Clemson University Department for Automotive Engineering
  • Clemson University International Center for Automotive Research

Categories

Differential Scanning Calorimetry, Adhesive Bonding, Adhesive, Adhesive Property, Mechanical Joint, Bonded Joint, Mechanical Design

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