Supplementary data for article Analysis of a Failure in a Molded Package Caused by Dendritic Growth
Published: 17 July 2020| Version 2 | DOI: 10.17632/vrt9k4tp5v.2
Contributor:
David BušekDescription
raw data, EDX analysis, penetration test and photos of analyzed samples
Files
Institutions
Ceske Vysoke Uceni Technicke Fakulta elektrotechnicka
Categories
Manufacturing, Physical Property of Package Material