Supplementary data for article Analysis of a Failure in a Molded Package Caused by Dendritic Growth

Name: Supplementary data for article Analysis of a Failure in a Molded Package Caused by Dendritic Growth
Creator: David Bušek
Published: 2020-07-17T10:31:25.570Z
Keywords: Manufacturing, Physical Property of Package Material

Bušek, David

doi:10.17632/vrt9k4tp5v.2

Supplementary data for article Analysis of a Failure in a Molded Package Caused by Dendritic Growth

Published: 17-07-2020| Version 2 | DOI: 10.17632/vrt9k4tp5v.2

Contributor:

David Bušek

Description

raw data, EDX analysis, penetration test and photos of analyzed samples

Supplementary data for article Analysis of a Failure in a Molded Package Caused by Dendritic Growth

Description

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