Thermal Modeling of Heat Transfer within LOM Heat Roller used for Laminate Hot-pressing or Boding: Heat Accumulation Model
Laminated Object Manufacturing (LOM) Rapid Prototyping Technology (RPT) is an efficient and suitable technique with many applications. However, its application for wood product prototyping (WPP), especially in micro-thin wood objects, namely different types of wood veneers, the thermal heat effect emanating from LOM heat sources, challenge the quality of the final 3D wood products. Therefore, regarding the parts and processes, which thermally affect the workpiece during object lamination (part-building phase), namely laser cutting and laminate bonding or hot pressing, this present report is a part of the understanding of the heat transfer within the heat roller of LOM RPT.
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The foremost vital procedures to be followed, resulting in the present data are enumerated within the document. Additionally, for material thermophysical, chemical, electrical properties, it is wise to undertake measurement techniques or collect data related to these parameters from suited database sites. Herein, the used sites are listed in the references section of the document. Furthermore, the use of numerical modeling software using for modeling and simulating physics-based issues is a necessity. As a result, here, COMSOL Multiphysics software version 5.4 has been utilized. Beneficially, this computer program gives an integrated and excellent environment for advancing related products with a single workflow. Within the COMSOL Multiphysics software program, the heat transfer in solid is included in the physics heat transfer interfaces. Moreover, there is a possibility of selecting stationary and transient time dependency studies for thermal conduction, convection, radiation of heat transfer modes with predefined heat sources for physics. This software allows scientists, engineers, and other interested experts to comprehend the behavior of different physical objects structure through computer modeling techniques of hands-on building and solving models through the direct application.