Microstructure and thermal stability of oxidized copper produced by electron beam powder bed fusion

Published: 1 July 2025| Version 1 | DOI: 10.17632/2b6g8jmysp.1
Contributor:
Prithwish Tarafder

Description

Raw data used for this study are uploaded based on their categories. Further SEM and TEM images can be obtained based on reasonable requests. EBSD data should be handled with proprietary software. Electrical conductivity results are from four point probe test. Mechanical test includes both microhardness and nanoindentation results.

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Categories

Electron Microscopy, Manufacturing, Mechanical Testing

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