Data for: Enhanced Dielectric Response and Thermal Conduction in Copper Nanoparticles Embedded Polyaniline Nanofibers

Published: 31 Aug 2019 | Version 1 | DOI: 10.17632/4hgvh5ngs4.1
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Description of this data

The file contains all the data related to experiments mentioned in the manuscript.

Experiment data files

This data is associated with the following publication:

Enhanced dielectric response and thermal conduction in copper nanoparticles embedded polyaniline nanofibers

Published in: Materials Science and Engineering: B

Latest version

  • Version 1

    2019-08-31

    Published: 2019-08-31

    DOI: 10.17632/4hgvh5ngs4.1

    Cite this dataset

    Wan, Meher (2019), “Data for: Enhanced Dielectric Response and Thermal Conduction in Copper Nanoparticles Embedded Polyaniline Nanofibers”, Mendeley Data, v1 http://dx.doi.org/10.17632/4hgvh5ngs4.1

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Dielectrics, Polymer Nanocomposites

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