Data for: Joining of Oxygen-Free High-Conductivity Cu to CuCrZr by Direct Diffusion Bonding without Using an Interlayer at Low Temperature

Published: 31 March 2020| Version 1 | DOI: 10.17632/7h2z76n385.1
Contributor:
Yuan Huang

Description

Some data on joining of OFHC to CuCrZr have been created. The data including shear strength, EDS results and C-scan results of Cu/CuCrZr joints (composite panels).

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Materials Science Engineering

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