Data for: Joining of Oxygen-Free High-Conductivity Cu to CuCrZr by Direct Diffusion Bonding without Using an Interlayer at Low Temperature
Published: 31 March 2020| Version 1 | DOI: 10.17632/7h2z76n385.1
Some data on joining of OFHC to CuCrZr have been created. The data including shear strength, EDS results and C-scan results of Cu/CuCrZr joints (composite panels).
Materials Science Engineering