Temperature-Sensitive Substrate and Product Binding Underlie Temperature-Compensated Phosphorylation in the Clock

Name: Temperature-Sensitive Substrate and Product Binding Underlie Temperature-Compensated Phosphorylation in the Clock
Creator: Yuta Shinohara
Published: 2017-09-07T16:00:15.406Z
Keywords: Biochemistry

Shinohara, Yuta; Koyama, Yohei; Ukai-Tadenuma, Maki; Hirokawa, Takatsugu; Kikuchi, Masaki; Yamada, Rikuhiro; Ukai, Hideki; Fujishima, Hiroshi; Umehara, Takashi; Tainaka, Kazuki; Ueda, Hiroki

doi:10.17632/8v6y744r3t.1

Temperature-Sensitive Substrate and Product Binding Underlie Temperature-Compensated Phosphorylation in the Clock

Published: 7 September 2017| Version 1 | DOI: 10.17632/8v6y744r3t.1

Contributors:

Yuta Shinohara, Yohei Koyama, Maki Ukai-Tadenuma, Takatsugu Hirokawa, Masaki Kikuchi, Rikuhiro Yamada, Hideki Ukai, Hiroshi Fujishima, Takashi Umehara, Kazuki Tainaka, Hiroki Ueda

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Raw images of SDS-PAGE analysis: purified budding yeast CKI homolog 1 (Figure S8B); purified wild-type TTBK1 (WT) and rationally designed TTBK1 mutant (rMT) (Figure S10B).

Temperature-Sensitive Substrate and Product Binding Underlie Temperature-Compensated Phosphorylation in the Clock

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