Data for: Prediction of void growth and fiber volume fraction based on filament winding process mechanics

Published: 2 March 2020| Version 1 | DOI: 10.17632/b7y24n6dxz.1
Contributor:
Qi Wang

Description

The isothermal DSC and non-thermal DSC data for the epoxy resin used in this study (TDE-86).

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Institutions

Dalian University of Technology

Categories

Differential Scanning Calorimetry, Cure Process, Thermosetting Resin

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