Data for: Prediction of void growth and fiber volume fraction based on filament winding process mechanics
Published: 2 March 2020| Version 1 | DOI: 10.17632/b7y24n6dxz.1
The isothermal DSC and non-thermal DSC data for the epoxy resin used in this study (TDE-86).
Dalian University of Technology
Differential Scanning Calorimetry, Cure Process, Thermosetting Resin