Data for: High-performance epoxy/binary spherical alumina composite as underfill material for electronic packaging

Name: Data for: High-performance epoxy/binary spherical alumina composite as underfill material for electronic packaging
Creator: Dean Shi
Published: 2018-12-26T22:38:59.532Z
Keywords: Flowability

Shi, Dean

doi:10.17632/d7xvd77rfp.1

Data for: High-performance epoxy/binary spherical alumina composite as underfill material for electronic packaging

Published: 26 December 2018| Version 1 | DOI: 10.17632/d7xvd77rfp.1

Contributor:

Dean Shi

Description

Flowability of EP-S-Al2O3 binary composite; AC conductivity, thermal conductivity and shear viscosity of EP-S-Al2O3 binary composites.

Data for: High-performance epoxy/binary spherical alumina composite as underfill material for electronic packaging

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