Simulation on Interplay Between Morphological Evolution and Defect in Polycrystalline TSV During EM
Published: 19 March 2024| Version 1 | DOI: 10.17632/g7tc9xc7wd.1
Contributor:
Zhiheng HuangDescription
Animations accompany the paper "Simulation on Interplay Between Morphological Evolution and Defect in Polycrystalline TSV During EM" published in IEEE Transactions on Electron Devices ( Volume: 71, Issue: 1, January 2024) Page(s): 322 - 330 DOI: 10.1109/TED.2023.3296708 Authors: Xin Zeng; Zhiheng Huang; Shuanjin Wang; Min Xiao; Yuezhong Meng; Yang Liu
Files
Institutions
Sun Yat-Sen University
Categories
Copper, Integrated Circuit, Microstructure, Phase Field Model, Electromigration, Electronic Packaging
Funding
National Natural Science Foundation of China
51832002