Simulation on Interplay Between Morphological Evolution and Defect in Polycrystalline TSV During EM

Published: 19 March 2024| Version 1 | DOI: 10.17632/g7tc9xc7wd.1
Contributor:
Zhiheng Huang

Description

Animations accompany the paper "Simulation on Interplay Between Morphological Evolution and Defect in Polycrystalline TSV During EM" published in IEEE Transactions on Electron Devices ( Volume: 71, Issue: 1, January 2024) Page(s): 322 - 330 DOI: 10.1109/TED.2023.3296708 Authors: Xin Zeng; Zhiheng Huang; Shuanjin Wang; Min Xiao; Yuezhong Meng; Yang Liu

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Institutions

Sun Yat-Sen University

Categories

Copper, Integrated Circuit, Microstructure, Phase Field Model, Electromigration, Electronic Packaging

Funding

National Natural Science Foundation of China

51832002

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