Dataset for "In-situ characterization of solidification and microstructural evolution during interrupted thermal fatigue in SAC305 and SAC105 solder joints using high energy X-ray diffraction and post-mortem EBSD analysis"

Published: 24 December 2020| Version 1 | DOI: 10.17632/k7cz57hz99.1
Contributors:
Quan Zhou,
Tae-kyu Lee,
Thomas Bieler

Description

This data set contains: 1) Images of diffraction patterns collected during in-situ cooling of the CABGA corner joints 2) Log files contain indexed orientations of the solder joints at different thermal cycling stages from Fable, using different "Peak Search" thresholds. 3) Raw EBSD scan data of samples at TC-750

Files

Institutions

Michigan State University

Categories

Electron Backscatter Diffraction, Diffraction Pattern

License