Analysis of a Failure in a Molded Package Caused by Dendritic Growth
Published: 16 July 2020| Version 1 | DOI: 10.17632/vrt9k4tp5v.1
Contributor:
David BušekDescription
raw data, EDX analysis and photos of analyzed samples
Files
Institutions
- Ceske Vysoke Uceni Technicke Fakulta elektrotechnicka
Categories
Manufacturing, Physical Property of Package Material