Data for: Plasmonic Nanoparticle-based Epoxy Photocuring

Published: 26 Oct 2018 | Version 1 | DOI: 10.17632/xp9cwv6mpb.1
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Description of this data

Contents
Appendix A. Electromagnetic simulations
Appendix B. Heat Transfer simulations
Appendix C. Influence of parameters
Appendix D. Aluminum nanoparticles: practicality and stacking effects
Appendix E. Bond strength with no nanoparticles
References

Experiment data files

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This data is associated with the following publication:

Plasmonic nanoparticle-based epoxy photocuring: A deeper look

Published in: Materials Today

Latest version

  • Version 1

    2018-10-26

    Published: 2018-10-26

    DOI: 10.17632/xp9cwv6mpb.1

    Cite this dataset

    Everitt, Henry; Alabastri, Alessandro; Roberts, Adam; Nordlander, Peter; Reish, Matthew; Halas, Naomi; Yang, Jian (2018), “Data for: Plasmonic Nanoparticle-based Epoxy Photocuring”, Mendeley Data, v1 http://dx.doi.org/10.17632/xp9cwv6mpb.1

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Categories

Composite Materials, Adhesive Bonding, Localized Surface Plasmon Resonance, Epoxy

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