Data for: Plasmonic Nanoparticle-based Epoxy Photocuring

Published: 26 Oct 2018 | Version 1 | DOI: 10.17632/xp9cwv6mpb.1

Description of this data

Appendix A. Electromagnetic simulations
Appendix B. Heat Transfer simulations
Appendix C. Influence of parameters
Appendix D. Aluminum nanoparticles: practicality and stacking effects
Appendix E. Bond strength with no nanoparticles

Experiment data files

This data is associated with the following publication:

Plasmonic nanoparticle-based epoxy photocuring: A deeper look

Published in: Materials Today

Latest version

  • Version 1


    Published: 2018-10-26

    DOI: 10.17632/xp9cwv6mpb.1

    Cite this dataset

    Everitt, Henry; Alabastri, Alessandro; Roberts, Adam; Nordlander, Peter; Reish, Matthew; Halas, Naomi; Yang, Jian (2018), “Data for: Plasmonic Nanoparticle-based Epoxy Photocuring”, Mendeley Data, v1


Views: 257
Downloads: 16


Composite Materials, Adhesive Bonding, Localized Surface Plasmon Resonance, Epoxy


CC BY 4.0 Learn more

The files associated with this dataset are licensed under a Creative Commons Attribution 4.0 International licence.

What does this mean?
You can share, copy and modify this dataset so long as you give appropriate credit, provide a link to the CC BY license, and indicate if changes were made, but you may not do so in a way that suggests the rights holder has endorsed you or your use of the dataset. Note that further permission may be required for any content within the dataset that is identified as belonging to a third party.